JPH0260274U - - Google Patents
Info
- Publication number
- JPH0260274U JPH0260274U JP13892088U JP13892088U JPH0260274U JP H0260274 U JPH0260274 U JP H0260274U JP 13892088 U JP13892088 U JP 13892088U JP 13892088 U JP13892088 U JP 13892088U JP H0260274 U JPH0260274 U JP H0260274U
- Authority
- JP
- Japan
- Prior art keywords
- thermal expansion
- expansion coefficient
- mounting seat
- circuit board
- outsert molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13892088U JPH0610716Y2 (ja) | 1988-10-25 | 1988-10-25 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13892088U JPH0610716Y2 (ja) | 1988-10-25 | 1988-10-25 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0260274U true JPH0260274U (en]) | 1990-05-02 |
| JPH0610716Y2 JPH0610716Y2 (ja) | 1994-03-16 |
Family
ID=31401700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13892088U Expired - Lifetime JPH0610716Y2 (ja) | 1988-10-25 | 1988-10-25 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610716Y2 (en]) |
-
1988
- 1988-10-25 JP JP13892088U patent/JPH0610716Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0610716Y2 (ja) | 1994-03-16 |